Solder paste - Company Ranking(8 companies in total)
Last Updated： Aggregation Period:May 06, 2026〜Jun 02, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 25 to 15 µm ■ Flux content: 14.5 ± 0.5% ■ Flux... | - Laser soldering for chip components below 1608 - Soldering of halogen-free assembled products | ||
| 【Specifications】 ■Compatible solder alloy: Sn5-Pb92.5-Ag2.5 ■Flux type: Halogen-free ■Halide content: 0% ■Powder particle size: 45–25μ... | High-heat generating components such as power semiconductors. | ||
| 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 45～25μm, 38～20μm, 25～15µm ■ Flux content: 14.0±0.5% ... | Soldering at ROL0 | ||
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石川金属
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- Featured Products
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Laser solder paste "EVASOL 3232 Series"
- overview
- 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 25 to 15 µm ■ Flux content: 14.5 ± 0.5% ■ Flux...
- Application/Performance example
- - Laser soldering for chip components below 1608 - Soldering of halogen-free assembled products
Sn-Pb syringe solder paste "SOLDIM Series"
- overview
- 【Specifications】 ■Compatible solder alloy: Sn5-Pb92.5-Ag2.5 ■Flux type: Halogen-free ■Halide content: 0% ■Powder particle size: 45–25μ...
- Application/Performance example
- High-heat generating components such as power semiconductors.
Halogen-free solder paste "EVASOL 3700 Series"
- overview
- 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 45～25μm, 38～20μm, 25～15µm ■ Flux content: 14.0±0.5% ...
- Application/Performance example
- Soldering at ROL0
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石川金属
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