Solder paste - Company Ranking(8 companies in total)
Last Updated： Aggregation Period:Sep 23, 2026〜Oct 20, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| For more details, please download the PDF or feel free to contact us. | 【Applications】 ■ Aluminum rigid substrates ■ Aluminum flexible substrates ■ Aluminum harnesses for EVs *For more details, please download t... | ||
| 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 38-25, 38-20, 32-15 µm ■ Flux content: 14.0±0.5,... | 【Applicable Examples】 ■ Chip components of 1608 or smaller ■ Smartphone camera modules, etc. *For more details, please refer to the PDF doc... | ||
| For more details, please feel free to contact us. | For more details, please feel free to contact us. | ||
|
---
--- |
--- | ||
石川金属
-
- Featured Products
-
Aluminum solder paste "EVASOL 4715, 4515 series"
- overview
- For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- 【Applications】 ■ Aluminum rigid substrates ■ Aluminum flexible substrates ■ Aluminum harnesses for EVs *For more details, please download t...
Laser solder paste "EVASOL 3230 Series"
- overview
- 【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 38-25, 38-20, 32-15 µm ■ Flux content: 14.0±0.5,...
- Application/Performance example
- 【Applicable Examples】 ■ Chip components of 1608 or smaller ■ Smartphone camera modules, etc. *For more details, please refer to the PDF doc...
Soldering defect: wet defect (solder paste)
- overview
- For more details, please feel free to contact us.
- Application/Performance example
- For more details, please feel free to contact us.
-
石川金属
Membership (free) is required to view all content.
Already a Member? Log In Here
